Semiconductor Process & Metrology Equipment
Marketing & Management Expertise
For Emerging Technologies
Representing
SRG Vacuum Gauge Systems
Precision Backgrinding & Substrate Thinning
CMP, Post-CMP Clean & Wafer Saw
- Spinning Rotor Gauge
- Accurate & physically robust sensors
- Replaces ion gauge tube or other sensors for Implant & Etch apps
- Vacuum Insulation sensor applications for hydrogen containment
CMP, Post-CMP Clean & Wafer Saw
Precision Backgrinding & Substrate Thinning
CMP, Post-CMP Clean & Wafer Saw
- CMP Tools -- University & Development
- Post-CMP Cleaning Tools
- CMP for SiC and hard materials
- Large-Format CMP Tools
- Precision Wafering Saws
Surface & Film Measurement
Precision Backgrinding & Substrate Thinning
Precision Backgrinding & Substrate Thinning
- High Throughput Optical Metrology
- Multilayer Measurement of Bonded Wafer Assemblies
- Substrate Thickness & Shape including, TTV, Bow, Warp & Stress.
- Thin Film Measurement
- AFM Quality Surface Topology & Profilometry
- Automated & Semi-Automated Systems
Precision Backgrinding & Substrate Thinning
Precision Backgrinding & Substrate Thinning
Precision Backgrinding & Substrate Thinning
- High precision surface grinding tools
- Applications for Silicon, SiC, and a wide array of semiconductor materials
- Compact & high reliability systems, and,
- Single and coaxial grind wheel options
- More than 50 years of backgrinding history